Updated on 2021/05/27

写真a

 
NISHIOKA Takeshi
 

Research Interests

  • Chemical Mechanical Polishing

  • Tribology

  • Solid Lubrication

Research Areas

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Machine elements and tribology

  • Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Design engineering

Education

  • Tohoku University   Doctor's Course   Completed

    - 2006.9

  • The University of Tokyo   Master's Course   Completed

    - 1983.3

  • The University of Tokyo   Graduated

    - 1981.3

Research History

  • Toshiba Corporation   Center for Semiconductor Research & Development   Chief Specialist

    1983.4 - 2016.8

  • Fukui University of Technology   Professor

    2016.9

Studying abroad experiences

  • 1990.8 - 1992.1   Vanderbilt University   Visiting Scholar

 

Papers

  • Modeling on Hydrodynamic Effects of Pad Surface Roughness in CMP Process Reviewed

    T.NISHIOKA, K.SEKINE, Y.TATEYAMA

    Proc. of 1999 IEEE International Interconnect Technology Conference   89 - 91   1999.5

  • Modeling on Mechanical Properties of Polishing Pads in CMP Process Reviewed

    T.NISHIOKA, et.al.

    Material Research Society Symposium   612   E1.5.1 - E1.5.6   2000.4

  • Study on Nano-Scale Wear of Silicon Oxide in CMP Process Reviewed

    S.SETA, T.NISHIOKA, Y.TATEYAMA, N.MIYASHITA

    Electrochemical Society Proc.   2000-26   28 - 33   2000.10

  • Extendibility of CMP Process to Cu/p-Low-k Interconnect Fabrications Invited Reviewed

    T.NISHIOKA, et.al.

    Proc. of 11th International Conf. on CMP Planarization   4E   2006.2

  • High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process Reviewed

    Y.MATSUI, et.al.

    J. of the Electrochemical Society   156 ( 7 )   H548 - H554   2009.7

  • Effects of Addition of Resin Particles to Ceria-Based Slurry on Pre-Metal Dielectric Planarization Reviewed

    Y.MATSUI, et.al.

    J. of the Electrochemical Society   157 ( 5 )   H510 - H515   2010.5

  • High-Performance CMP Slurry with CeO2/Resin Abrasive for STI Formation Reviewed

    Y.MATSUI, et.al.

    Electrochemical Society Trns.   116 ( 6 )   277 - 283   2007.10

  • Application of Bevel Polishing to Defect Reduction in FEOL Process Flow Reviewed

    A.SHIGETA, et.al.

    Proc. of 12th International Conf. on CMP Planarization   3C   2007.2

  • Cu Slurry Design for Cu/Low-k Interconnects Reviewed

    Y.TATEYAMA, et.al.

    Proc. of 12th International Conf. on CMP Planarization   2A   2007.2

  • Post Copper CMP Cleaning of Low-k Surface Using Resin Particles Reviewed

    N.KURASHIMA, et.al.

    Proc. of 11th International Conf. on CMP Planarization   9B   2006.2

  • Mechanism of Moisture Uptake Induced Via Failure and its Impact on 45nm Node Interconnect Design Reviewed

    T.FUJIMAKI, et.al.

    Proc. of 2005 IEEE International Electron Device Meeting   183   2005.12

  • Focus Error Reduction by Photo-Resist Planarization in Via First Dual Damascene Process Reviewed

    Y.MATSUI, et.al.

    Proc. of 2005 IEEE International Interconnect Technology Conference   162   2005.5

  • Dynamical Contact Simulation by Finite Element Method for Chemical Mechanical Polishing Process Reviewed

    D.NAKAYAMA, H.NOGUCHI, T.NISHIOKA, T.KAWAKAMI

    Proc. of 2nd International Conf. on Structural Stability and Dynamics   1   647   2002.12

  • A New Poly-Si CMP Process with Small Erosion for Advanced Trench Isolation Process Reviewed

    N.MIYASHITA, et.al.

    Material Research Society Symposium   612   D11.3.1   2000.4

  • An Experimental Study on the Surface Modification of Ceramics for Vacuum Use Reviewed

    H.MARUMO, T.SHIKANAI, T.NISHIOKA

    Proc. of 5th InternationalCong. on Tribology   295 - 298   1989.6

  • Development of Ball Bearings for a Paddle Drive Mechanisms Reviewed

    Y.MIYAKAWA, et.al.

    Proc. of 15th International Symp. on Space Technology and Science   775 - 779   1986.5

  • Hydrodynamic Lubrication by Micro-asperities Reviewed

    Y.KIMURA, T.NISHIOKA

    Proc. of JSLE International Tribology Conf.   223 - 226   1985.7

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Presentations

  • Application of the Modeling Based on the Contact Pressure analyses for CMP Process International conference

    T.NISHIOKA, Y.TATEYAMA, N.MIYASHITA, H.YANO

    Material Research Society Spring Meeting 

  • The Effects of Molybdenum Intermediate Layers on the Frictional Properties of Silver Films for Vacuum Use International conference

    T.NISHIOKA, K.SEKINE, K.MATSUMOTO, H.MARUMO

    International Tribology Conference Yokohama 

  • 宇宙ステーション用軸受の基礎試験

    山本昌孝他

    宇宙科学技術連合講演会