Research Interests
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Solid Lubrication
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Tribology
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Chemical Mechanical Polishing
Updated on 2024/12/20
Solid Lubrication
Tribology
Chemical Mechanical Polishing
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Machine elements and tribology
Manufacturing Technology (Mechanical Engineering, Electrical and Electronic Engineering, Chemical Engineering) / Design engineering
Tohoku University Doctor's Course Completed
- 2006.9
The University of Tokyo Master's Course Completed
- 1983.3
The University of Tokyo Graduated
- 1981.3
Toshiba Corporation Center for Semiconductor Research & Development Chief Specialist
1983.4 - 2016.8
Fukui University of Technology Professor
2016.9
1990.8 - 1992.1 Vanderbilt University Visiting Scholar
Modeling on Hydrodynamic Effects of Pad Surface Roughness in CMP Process Reviewed International journal
T.NISHIOKA, K.SEKINE, Y.TATEYAMA
Proc. of 1999 IEEE International Interconnect Technology Conference 89 - 91 1999.5
Modeling on Mechanical Properties of Polishing Pads in CMP Process Reviewed International journal
T.NISHIOKA, et.al.
Material Research Society Symposium 612 E1.5.1 - E1.5.6 2000.4
Study on Nano-Scale Wear of Silicon Oxide in CMP Process Reviewed
S.SETA, T.NISHIOKA, Y.TATEYAMA, N.MIYASHITA
Electrochemical Society Proc. 2000-26 28 - 33 2000.10
Extendibility of CMP Process to Cu/p-Low-k Interconnect Fabrications Invited Reviewed International journal
T.NISHIOKA, et.al.
Proc. of 11th International Conf. on CMP Planarization 4E 2006.2
High Performance Photoresist Planarization Process by CMP with Resin Abrasive for Trench-First Cu/Low-k Dual Damascene Process Reviewed
Y.MATSUI, et.al.
J. of the Electrochemical Society 156 ( 7 ) H548 - H554 2009.7
Effects of alumina abrasive size and impact condition on MSE properties of copper
Jian WANG, Takeshi NISHIOKA, Hozumi YASUDA, Yutaka WADA, Hirokuni HIYAMA
ABTEC2024 2024.8 The Japan Society for Abrasive Technology
Effect of Impact Angle on Micro Slurry-jet Erosion of SiO2 Film
2022.11 Japanese Society of Tribologists
Application of the Modeling Based on the Contact Pressure analyses for CMP Process International conference
T.NISHIOKA, Y.TATEYAMA, N.MIYASHITA, H.YANO
Material Research Society Spring Meeting
The Effects of Molybdenum Intermediate Layers on the Frictional Properties of Silver Films for Vacuum Use International conference
T.NISHIOKA, K.SEKINE, K.MATSUMOTO, H.MARUMO
International Tribology Conference Yokohama
宇宙ステーション用軸受の基礎試験
山本昌孝他
宇宙科学技術連合講演会